← Portfolio fitCOMPUTATIONAL MATERIALS DISCOVERY3 matched portfolios

Lattice Graph × Absolics (SKC)

First-mover glass-substrate commercialization

Absolics, the SKC subsidiary, is the first mover commercializing glass substrates at scale — backed by CHIPS and NAPMP funding and sampling to AMD from its Covington, Georgia fab. As the company actually shipping glass-core, it is the best co-development and license target for the liner, barrier, and dielectric chemistries that ride on top of the glass.

Why nowAbsolics is already sampling glass-core substrates to AMD from Covington with approximately $175 million in federal funding behind it — the liner, barrier, and RDL dielectric decisions that will define the production stack are being made right now, and locking in validated, IP-clean chemistry before those process nodes are committed is a closing window, not a future option.

What our platform does for Absolics (SKC)

Lattice Graph is a computational materials-discovery platform built around a knowledge graph spanning millions of compositions. Every candidate material must earn consensus validation across multiple independent machine-learning interatomic potentials — MACE, CHGNet, MatterSim, and ORB — before advancing, and phonon and thermodynamic stability are required checkpoints, not optional filters. Materials that clear that bar proceed to targeted density-functional-theory simulations and, ultimately, to deposition-ready specifications. This multi-potential consensus architecture is designed precisely to eliminate the false positives that plague single-model workflows and that cost months of fab time when a barrier film delaminations or a dielectric leaks. Beyond candidate generation, Lattice Graph carries a large, curated atlas of labeled negative results — failed synthesis attempts and disqualified compositions — so the search space collapses before a single wafer is touched. Freedom-to-operate and patent-whitespace screening across more than 300,000 materials patents is embedded in the same platform, meaning IP risk is assessed at the composition level, not as an afterthought once a formulation is already in the process roadmap. The result is a full-stack discovery engine: from composition hypothesis, through multi-potential validation and DFT refinement, to intellectual-property clarity — all before pilot deposition.

Why Lattice Graph × Absolics (SKC)

Absolics occupies a singular position in the advanced-packaging supply chain: as the SKC subsidiary that is already manufacturing glass-core substrates at its Covington, Georgia fab and sampling to AMD, it is the one company in the ecosystem that needs chemistry stack solutions now, not at some future inflection point. The approximately $75 million in CHIPS Act funding and approximately $100 million in NAPMP support mean Absolics has the capital and the government mandate to move quickly — and the pressure to arrive at production chemistry with clean intellectual-property standing, because every layer above the glass will be scrutinized by customers, partners, and regulators alike. Lattice Graph maps directly to that commercial reality. The platform's Glass-core advanced-packaging substrates portfolio was built around precisely the liner, barrier, and redistribution-layer dielectric chemistries that Absolics needs to license or co-develop to complete its stack. Rather than directing Absolics toward a portfolio of speculative compositions, we can offer materials that have already cleared multi-potential thermodynamic consensus, freedom-to-operate screening across the relevant patent landscape, and process sequences designed for ALD/CVD deposition — arriving at Absolics' process integration team ready for qualification, not for further basic research. The co-development and licensing fit is structural, not coincidental. Absolics ships the glass; Lattice Graph holds the IP for what goes on top of it. That combination — first-mover substrate platform plus validated, IP-clean chemistry stack — is the proposition that hyperscaler and accelerator customers like AMD are waiting for the industry to deliver at scale. An engagement now positions both organizations to present a unified, deposition-ready glass-core package to the market before competing organic-substrate incumbents can answer.

Absolics (SKC) business lines

  • Glass-substrate manufacturing (Covington, GA)
  • Through-glass-via & RDL integration
  • CHIPS / NAPMP-backed scale-up
  • Hyperscaler & accelerator substrate supply

Where we fit

Absolics is already shipping glass — what it needs is the chemistry stack on top: an AlN via liner that turns the via into a heat path, a thin copper-diffusion barrier, and a sub-2-micron RDL dielectric ladder. This is a co-development and license fit, not just an acquisition target, with the IP arriving deposition-ready and freedom-to-operate-clean.

Why nowAbsolics is already sampling glass-core substrates to AMD from Covington with approximately $175 million in federal funding behind it — the liner, barrier, and RDL dielectric decisions that will define the production stack are being made right now, and locking in validated, IP-clean chemistry before those process nodes are committed is a closing window, not a future option.

The Lattice Graph fit for Absolics (SKC)

Absolics occupies a singular position in the advanced-packaging supply chain: as the SKC subsidiary that is already manufacturing glass-core substrates at its Covington, Georgia fab and sampling to AMD, it is the one company in the ecosystem that needs chemistry stack solutions now, not at some future inflection point. The approximately $75 million in CHIPS Act funding and approximately $100 million in NAPMP support mean Absolics has the capital and the government mandate to move quickly — and the pressure to arrive at production chemistry with clean intellectual-property standing, because every layer above the glass will be scrutinized by customers, partners, and regulators alike. Lattice Graph maps directly to that commercial reality. The platform's Glass-core advanced-packaging substrates portfolio was built around precisely the liner, barrier, and redistribution-layer dielectric chemistries that Absolics needs to license or co-develop to complete its stack. Rather than directing Absolics toward a portfolio of speculative compositions, we can offer materials that have already cleared multi-potential thermodynamic consensus, freedom-to-operate screening across the relevant patent landscape, and process sequences designed for ALD/CVD deposition — arriving at Absolics' process integration team ready for qualification, not for further basic research. The co-development and licensing fit is structural, not coincidental. Absolics ships the glass; Lattice Graph holds the IP for what goes on top of it. That combination — first-mover substrate platform plus validated, IP-clean chemistry stack — is the proposition that hyperscaler and accelerator customers like AMD are waiting for the industry to deliver at scale. An engagement now positions both organizations to present a unified, deposition-ready glass-core package to the market before competing organic-substrate incumbents can answer.

Portfolio fit for Absolics (SKC)

The Glass-core advanced-packaging substrates portfolio is the primary fit. It contains the through-glass-via liner, copper diffusion barrier, redistribution-layer dielectric, and integrated stack claims that map one-for-one to Absolics' process integration roadmap. The aluminum nitride thermal liner converts a via wall from a thermal resistance into an active heat path — a direct answer to the thermal management challenge that arises as Absolics scales to high-power accelerator packages for customers like AMD. The tungsten boride copper diffusion barrier operates at sub-TaN thickness, which preserves via geometric budget in high-aspect-ratio through-glass vias that Absolics' glass platform uniquely enables. The ordered fabrication method claims cover the full deposition sequence and are structured to be licensed as a manufacturing process, not just as materials claims. The Integrated packaging, storage and PFAS-treatment systems portfolio adds two additional layers of value. Its bandgap-graded borate and oxynitride multilayer dielectric stack enables sub-2-micron redistribution-layer pitch — critical for the fine-pitch RDL that differentiates glass-core from conventional organic laminate at the electrical level. The barium hafnate Ruddlesden-Popper high-permittivity dielectric offers a path to integrating high-density MIM capacitors directly into the package, a capability hyperscaler customers are increasingly demanding for on-package power delivery. Both assets carry clean freedom-to-operate status across the screened patent landscape. The High-power thermal-interface materials portfolio rounds out the picture at the assembled-package level. As Absolics' glass substrate moves from sampling to volume supply, the thermal interface between the package and the heat spreader becomes a co-optimization problem — and materials in this portfolio have been validated against the same multi-potential thermodynamic framework as the via and dielectric chemistries, ensuring compatibility across the full stack.

Discoveries we'd license to Absolics (SKC)

See the full portfolio →

Selected from our discovery portfolio and weighted to Absolics (SKC)'s programs — each computationally validated and dossier-ready. Open any for the full technical read.

★ Flagship2-engine validated

Aluminum nitride thermal liner for through-glass vias in advanced packaging

Wurtzite AlN via-wall liner converts a through-glass via from a thermal bottleneck into an active heat path, cutting through-via thermal resistance by 50% or more.

Clear IP pathAlN
Market $10B+semiconductor packagingDetails →
★ Flagship2-engine validated

Integrated glass-core advanced-packaging substrate stack

Single ordered glass-core article spanning thermal liner, Cu barrier, dielectric, cap, and passive layers — each layer teardown-verifiable and qualified against 16 package reliability endpoints.

Clear IP path
Market $10B+semiconductor packagingDetails →
★ Flagship2-engine validated

Tungsten boride copper diffusion barrier on alumina-borate liner for glass-core vias

Refractory tungsten boride Cu barrier on an alumina-borate adhesion liner blocks copper diffusion at sub-TaN film thickness, freeing via geometric budget in high-aspect-ratio through-glass vias.

Clear IP pathB2W / WBx (x~1.5-2.5)
Market $5B+semiconductor packagingDetails →
★ Flagship3-engine validated

Glass-core packaging stack with aluminum borate liner, tungsten boride barrier, and chlorine-retaining RDL dielectric

Integrated glass-core substrate stack combining a conformal AlBO3 liner, a crystalline WB2 copper diffusion barrier, and a retained-chlorine amorphous dielectric for advanced semiconductor packaging.

Defined carve-outAlBO3 / WB2 / AlOxCly
Market $10B+semiconductor packagingDetails →
StrongSimulation-screened

Ordered fabrication method for integrated glass-core advanced-packaging substrates

A process claim covering the ordered deposition sequence — thermal liner, Cu barrier, gradient sublayer, copper fill, cap, dielectric, and high-k passive — for manufacturing the integrated glass-core package stack.

Clear IP path
Market $5B+semiconductor packaging fabDetails →
★ Flagship2-engine validated

Barium hafnate Ruddlesden-Popper high-permittivity dielectric for MIM capacitors

Layered perovskite Ba2HfO4 delivers permittivity ~53.5 with a wide bandgap for leakage-free, high-density MIM capacitors in DRAM and advanced packaging.

Clear IP pathBa2HfO4
Market $1-5Bsemiconductor memoryDetails →

Why these fit Absolics (SKC)

Aluminum nitride thermal liner for through-glass vias in advanced packaging

As Absolics scales to supply accelerator packages for customers like AMD, the through-glass via becomes a thermal bottleneck that limits package power density. The wurtzite AlN liner converts that via wall into an active heat path, cutting through-via thermal resistance by 50% or more — a direct enabler of high-power glass-core packaging that no organic-substrate competitor can match. The composition carries clean freedom-to-operate status and is specified for ALD deposition, making it compatible with Absolics' existing process infrastructure.

Tungsten boride copper diffusion barrier on alumina-borate liner for glass-core vias

High-aspect-ratio through-glass vias — one of the defining advantages of Absolics' glass platform over organic laminates — impose a severe geometric constraint on barrier films: every nanometer consumed by the barrier is a nanometer lost from the copper conductor. The refractory tungsten boride barrier blocks copper diffusion at sub-TaN thickness, preserving the full benefit of Absolics' via geometry while meeting the copper-reliability requirements AMD and other hyperscaler customers impose. The alumina-borate adhesion liner underneath provides the conformality needed on glass via walls.

Bandgap-graded borate and oxynitride multilayer dielectric stack for sub-2-micron packaging

Fine-pitch redistribution layers below 2 microns are what separates a glass-core substrate from a commodity laminate in the eyes of compute-chip customers. This bandgap-graded dielectric ladder suppresses carrier injection at each conductor interface, enabling the sub-2-micron RDL pitch that makes Absolics' glass platform competitive at the leading edge. The asset carries clean freedom-to-operate status and is the dielectric counterpart to the via liner and barrier claims, meaning it completes the chemistry stack above the glass rather than requiring Absolics to source a dielectric independently.

Integrated glass-core advanced-packaging substrate stack

A single ordered-stack claim spanning thermal liner, copper barrier, dielectric, cap, and passive layers — qualified against 16 package reliability endpoints — gives Absolics a licensable system-level IP position, not just a collection of individual material claims. For the CHIPS Act and NAPMP reporting obligations that accompany Absolics' roughly $175 million in federal funding, arriving at customer qualification with a stack that is both teardown-verifiable and IP-clean under a single license is a significant program-management advantage.

The challenge

Name a computational feat you think we can't do.

Absolics must qualify a copper diffusion barrier inside a high-aspect-ratio through-glass via where every nanometer of barrier film directly reduces the copper conductor cross-section and increases via resistance — yet the barrier must block copper migration at 400 C anneal conditions to satisfy package reliability requirements for AMD-class accelerator loads. Standard TaN solutions consume too much geometric budget at the aspect ratios Absolics' glass platform enables, and no commercially available alternative has been validated for thermodynamic stability on a glass via wall at those temperatures. Lattice Graph's multi-potential consensus validation and the tungsten boride barrier asset address exactly this constraint, with a composition that has cleared phonon stability across four independent potentials and carries a clean freedom-to-operate standing in the relevant patent space.

Send us a challenge →

APIs & data for Absolics (SKC)

Live data and API products running on our production platform — licensed to your team, with full schemas and access terms on request.

The Knowledge-Graph API gives Absolics' materials and process integration engineers direct programmatic access to provenance-tracked composition data, evidence neighborhoods, and natural-language graph queries across Lattice Graph's full composition space. For a company at Absolics' stage — moving from sampling to volume qualification — the practical value is speed: an engineer can query the graph for all compositions that have cleared multi-potential phonon stability within a target deposition-temperature window, or retrieve the full evidence chain behind a specific barrier candidate, without waiting for a research handoff. Composition-360 views aggregate synthesis routes, failure modes, and prior-art signals into a single retrievable record per material, so the team integrating barrier films at Covington works from the same validated dataset that generated the IP. The freedom-to-operate and patent-whitespace API operates at the composition and claim level across more than 300,000 materials patents, which is the relevant scale for a company preparing to file and defend packaging-chemistry IP while simultaneously licensing from external sources. For Absolics, where CHIPS Act funding brings heightened scrutiny of the IP landscape and where co-development agreements with customers like AMD will require clear ownership boundaries, having composition-level freedom-to-operate assessments available programmatically — rather than commissioned as one-off legal opinions — changes both the pace and the cost of IP due diligence during process development.

FTO / Patent-Whitespace API

Composition- and claim-level freedom-to-operate and patent-whitespace screening across 306K materials patents.

Knowledge-Graph API

Provenance, composition-360, evidence neighborhoods, and natural-language graph queries across the materials knowledge graph.

In the platform for Absolics (SKC)

The Lattice Graph application gives Absolics' materials team a single workspace for every stage of stack development, from initial composition screening through qualification reporting. Multi-potential validation results — covering MACE, CHGNet, MatterSim, and ORB in parallel — are displayed side by side so engineers can immediately see where consensus holds and where models diverge, which is the signal that matters for de-risking a deposition decision. Phonon stability and thermodynamic stability assessments are integrated into the same view, not presented as separate analysis artifacts, so the team moves from hypothesis to a qualified candidate in one workflow rather than across disconnected tools. The negative-results atlas is surfaced directly in the application, meaning that when an engineer is evaluating a barrier or liner candidate, failed prior compositions in the same chemistry space are visible as context — with the specific failure modes labeled — rather than buried in literature or internal notebooks. Freedom-to-operate status is rendered at the composition level alongside stability data, so the process integration team at Covington knows the IP standing of every candidate they are actively considering for deposition. For Absolics' reporting obligations under its CHIPS and NAPMP agreements, the application's provenance tracking provides an auditable record of how each qualified composition was validated, which simplifies the technical documentation that federal program milestones require.

How an engagement works

A Lattice Graph engagement with Absolics begins with a targeted chemistry-stack audit: we map Absolics' current via liner, barrier, and RDL dielectric process targets against the topAssets in the Glass-core advanced-packaging substrates portfolio and the Integrated packaging, storage and PFAS-treatment systems portfolio, identify the closest validated compositions, and deliver freedom-to-operate assessments for each. This first phase is designed to run in parallel with Absolics' ongoing process integration work at Covington, so there is no delay to the sampling program already underway with AMD. Deliverables include ranked candidate specifications, deposition-parameter guidance derived from multi-potential validation, and a composition-level IP landscape report covering the most relevant patent families. From there, an engagement typically moves to a co-development structure or a direct license, depending on Absolics' preference for internal ownership versus speed to qualification. In a co-development arrangement, Lattice Graph provides ongoing platform access — including Knowledge-Graph API and freedom-to-operate API calls — as the Absolics team iterates on deposition conditions, with the platform's negative-results atlas actively informing which failure modes to anticipate at each integration step. Licensing is structured around the specific asset or stack claims that enter Absolics' process roadmap, with pricing calibrated to the addressable market size of the relevant portfolio rather than a flat platform fee. Both paths are designed to deliver a chemistry stack that arrives at AMD qualification with a clean intellectual-property chain — the outcome Absolics' commercial position and federal funding obligations both require.

Build the Absolics (SKC) package

Request the full dossiers and licensing terms for the discoveries above — or scope a supply, co-development, or acquisition conversation.

Company names, logos, and trademarks are the property of their respective owners and are referenced here for identification and illustrative purposes only. Their inclusion reflects Lattice Graph's own analysis of where its portfolio may be relevant and does not imply any partnership, endorsement, affiliation, sponsorship, or existing commercial relationship.
Results are informational and should be validated by qualified professionals. See Terms of Service