Lattice Graph × Lam Research

Lattice Graph is a computational materials-discovery platform purpose-built for the precision demands of advanced semiconductor process chemistry. At its core sits a knowledge graph spanning millions of compositions, each node carrying provenance-traced experimental and simulation data across thermodynamic, structural, electronic, and mechanical property dimensions. Every candidate material that emerges from the graph must clear a consensus gate: independent validation by four machine-learning interatomic potentials — MACE, CHGNet, MatterSim, and ORB — followed by density-functional-theory confirmation of phonon and thermodynamic stability before it advances to targeted simulation. That multi-validator architecture means the compositions Lattice Graph surfaces are not artifacts of a single model's training distribution; they are candidates that survive adversarial interrogation by the current frontier of atomistic simulation. Beyond property prediction, the platform integrates freedom-to-operate and patent-whitespace screening across more than 300,000 materials patents at the composition-and-claim level, so a chemistry that clears the stability gate can be immediately evaluated for IP exposure before any experimental spend is committed. A large atlas of labeled negative results — failed syntheses and deposition experiments — is embedded in the graph, turning the industry's least-shared data asset into a systematic filter that prevents rediscovery of known dead ends. For equipment makers and process integrators, this means the platform delivers not only ranked candidate chemistries but also the IP context and failure-mode intelligence needed to license, build around, or design experiments with confidence.

Lam Research's ALD, CVD, and etch platforms are the physical infrastructure on which the next generation of glass-core packaging will be manufactured. As the co-bidder alongside Applied Materials for BESI's hybrid-bonding position, Lam is navigating a competitive landscape in which process chemistry is as determinative as tool hardware. The through-glass-via liner, the copper-diffusion barrier, and the redistribution-layer dielectric that run on Lam's own tool flows are precisely the material layers where Lattice Graph holds validated, patent-clean IP — IP that, when licensed, creates both an defensible position for Lam and a consumable pull-through dynamic tied directly to the installed base of Lam deposition and etch systems. The advanced IC-substrate market that Lam is competing for is projected by Yole to approach $31 billion by 2030, and glass-core technology is the inflection point that drives that expansion. Lam's challenge is that glass-core process integration is a materials problem before it is a tool problem: the via liner must manage thermal mismatch and conduction simultaneously, the copper barrier must block diffusion at sub-tantalum-nitride thicknesses to preserve geometric budget in high-aspect-ratio vias, and the dielectric stack must support sub-2-micron redistribution-layer pitch. Lattice Graph's glass-core portfolio addresses each of those constraints with compositions that have been validated by consensus across multiple simulation frameworks and screened for clear IP paths against the relevant patent landscape. The structural fit between Lattice Graph's chemistry portfolio and Lam's tool flows is not coincidental. The aluminum nitride thermal liner, the tungsten boride copper barrier, and the integrated glass-core stack were developed with ALD and CVD deposition sequences in mind. Licensing those chemistries gives Lam a materials IP position that complements its tool IP, binds the process chemistry to Lam's equipment through optimized deposition recipes, and converts each glass-core substrate manufactured on a Lam system into a recurring consumable relationship — a model that the broader semiconductor equipment industry has long recognized as the highest-value version of a capital equipment sale.

Lam Research's ALD, CVD, and etch platforms are the physical infrastructure on which the next generation of glass-core packaging will be manufactured. As the co-bidder alongside Applied Materials for BESI's hybrid-bonding position, Lam is navigating a competitive landscape in which process chemistry is as determinative as tool hardware. The through-glass-via liner, the copper-diffusion barrier, and the redistribution-layer dielectric that run on Lam's own tool flows are precisely the material layers where Lattice Graph holds validated, patent-clean IP — IP that, when licensed, creates both an defensible position for Lam and a consumable pull-through dynamic tied directly to the installed base of Lam deposition and etch systems. The advanced IC-substrate market that Lam is competing for is projected by Yole to approach $31 billion by 2030, and glass-core technology is the inflection point that drives that expansion. Lam's challenge is that glass-core process integration is a materials problem before it is a tool problem: the via liner must manage thermal mismatch and conduction simultaneously, the copper barrier must block diffusion at sub-tantalum-nitride thicknesses to preserve geometric budget in high-aspect-ratio vias, and the dielectric stack must support sub-2-micron redistribution-layer pitch. Lattice Graph's glass-core portfolio addresses each of those constraints with compositions that have been validated by consensus across multiple simulation frameworks and screened for clear IP paths against the relevant patent landscape. The structural fit between Lattice Graph's chemistry portfolio and Lam's tool flows is not coincidental. The aluminum nitride thermal liner, the tungsten boride copper barrier, and the integrated glass-core stack were developed with ALD and CVD deposition sequences in mind. Licensing those chemistries gives Lam a materials IP position that complements its tool IP, binds the process chemistry to Lam's equipment through optimized deposition recipes, and converts each glass-core substrate manufactured on a Lam system into a recurring consumable relationship — a model that the broader semiconductor equipment industry has long recognized as the highest-value version of a capital equipment sale.

The Glass-core advanced-packaging substrates portfolio is the primary match for Lam's current programs. It covers the aluminum nitride thermal liner for through-glass vias — which converts the via wall from a thermal bottleneck into an active heat path — the tungsten boride copper-diffusion barrier that blocks copper migration at thicknesses below conventional tantalum nitride films, and the integrated glass-core substrate stack that combines liner, barrier, dielectric, cap, and passive layers in a single ordered article qualified against sixteen package reliability endpoints. Each of these compositions is designed to be deposited by ALD or CVD on the type of tool flows Lam operates, and the fabrication-method claims in this portfolio cover the ordered deposition sequence explicitly, giving Lam both material and process IP when it licenses. The Integrated packaging, storage and PFAS-treatment systems portfolio extends that coverage into the full substrate system. The bandgap-graded borate and oxynitride multilayer dielectric stack in this portfolio targets sub-2-micron redistribution-layer pitch in glass-core packaging — directly relevant as Lam's etch capability is what enables fine-pitch RDL patterning. The chlorine-retaining amorphous dielectric in the integrated stack is a process-chemistry asset that emerges naturally from halide-based etch and CVD sequences, creating a compositional handle that is native to Lam's process environment rather than imposed on it. The Dielectric, ferroelectric and wide-bandgap oxides portfolio adds further relevance through high-permittivity gate and MIM-capacitor dielectrics for the memory process integration — specifically HBM and DRAM stacks — that constitute another of Lam's major business lines.

Lam's process integration and advanced-packaging teams would interact with Lattice Graph primarily through the materials discovery workbench, which presents ranked candidate compositions alongside the full evidence trail — stability validations from each of the four interatomic potential models, DFT phonon spectra, and the specific negative results that bound the viable composition space. For a team evaluating ALD precursors or CVD targets for a new liner or barrier chemistry, the workbench provides the property context and failure-mode intelligence that would otherwise require months of internal experimental screening. The patent-whitespace module within the platform connects directly to the screening API, presenting composition-level freedom-to-operate findings and identifying open whitespace regions in the glass-core via and RDL dielectric patent landscape. Integration engineers can move from a Lattice Graph candidate composition to a clear IP picture in the same session, without routing through a separate patent analytics tool. For Lam's IP and licensing teams, the platform supports portfolio-level queries — mapping Lam's existing process patent claims against the Lattice Graph material portfolio to identify where chemistry licensing would complement rather than compete with Lam's own IP position.

A Lattice Graph engagement with Lam Research would begin with a focused technical alignment session between Lam's process integration leads and Lattice Graph's materials scientists, scoped to the specific via liner, copper barrier, and RDL dielectric targets most relevant to Lam's glass-core roadmap. In that session, Lattice Graph would run live composition queries and freedom-to-operate screenings against Lam's stated performance specifications — via aspect ratio, deposition temperature window, target barrier thickness, RDL pitch — and return a ranked shortlist of validated candidates within days, not quarters. From there, the standard engagement structure moves through a data-room access period during which Lam's technical and IP teams conduct due diligence against the full evidence packages for selected assets, followed by a licensing term sheet for the specific compositions and method claims relevant to Lam's programs. Lattice Graph also offers an ongoing API access tier for teams that want to embed composition screening and freedom-to-operate queries directly into their internal process development workflows. Engagement scope and pricing are calibrated to the number of asset families licensed and the breadth of API access, and Lattice Graph's team can structure arrangements that align with Lam's standard IP licensing frameworks for process chemistry.